Main Application
HP-X100A is a lead-free, no-clean solder paste featuring a wide process window, low void defects, and compatibility with SAC305, SAC105, and SAC0307 alloys. It is suitable for the reflow soldering process of precision electronic components. This product can meet the requirements of stable fine-pitch printing capability and exhibits excellent online testing performance in terms of void prevention and head pillow defect prevention.
Quality Characteristics
Alloy Composition: Sn/Ag/Cu
Diameter: 0.05-1.8mm
Shape: Spherical
Appearance: Bright silver in color, free from contaminants, impurities, depressions, bumps, and connected balls.
Packaging Quantity: 100K/200K/250K/500K/1000K/2000K/3000K/5000K per bottle, or customizable according to customer requirements.
Specification: In accordance with the specifications of SJ/T 11584-2016.
Features: Refined from pure tin, pure silver, and pure copper, with extremely low impurity content.
Application: For IC packaging and motherboard ball mounting.
Quality Guarantee Period
12 months
Storage Conditions
Ambient Temperature: 10℃-30℃
Humidity: 30%RH-70%RH
It should be stored in a dry and clean environment.
Standard Products
Material: Sn96.5/Ag3/Cu0.5
Specification: 200/250/300/350/400/450/500/550/600/650/760 microns
Customized Products
Material:
Gold-tin (AuSn) and tin-antimony-based high-temperature solders;
Tin-copper (SnCu), tin-silver (SnAg), and tin-silver-copper (SnAgCu)-based medium-temperature solders;
Tin-zinc (SnZn), tin-bismuth (SnBi), and tin-indium (SnIn)-based low-temperature solders.
Specification: Customizable size range of 50-1800 microns.
Customizable Melting Point: Alloy solders with a melting point ranging from 118℃ to 350℃.