Copper Wrapped Column
The core composition and solder column dimensions can be customized according to the requirements of aerospace materials.
Product Name: Copper Strip Spiral Solder Column
Main Application: This product is specially designed for the stud bumping process in IC packaging. Quality Characteristics
Main Alloys:
a. Column Core: Pb80/Sn20
b. Copper Strip: Cu100 (oxygen-free copper)
c. Coating: Sn63/Pb37
Shape: Spiral cylinder
Appearance: Silvery white in color, free of contaminants, impurities, defects, excess material, and deformation.
Packaging Quantity: 10K/15K/20K/25K/30K per bottle, or customizable according to customer requirements.
Features: Compared with other types of solder columns, it has higher anti-vibration reliability.
Usage: For stud bumping in IC packaging.
Quality Guarantee Period: 12 months
Storage Conditions: Ambient temperature: 10℃ - 30℃; Relative humidity: 30%RH - 70%RH; Should be stored in a dry and clean environment.