Micro-Coil Spring


Its columnar structure, resembling a miniature spring damper, can effectively "absorb deformation stress" and resist fatigue damage when subjected to cyclic temperature changes. During the intense vibration and impact of the launch phase, it provides strong mechanical support to prevent solder joint fracture, thereby ensuring the reliable operation of the equipment in the space environment.


 Main Application: This product is dedicated to the pillar planting process of IC packaging.
 Quality Characteristics

 

Main Alloys:
Copper Wire: C17200 Beryllium Copper
Coating: Sn60/Pb40

Shape: Spring-like

Appearance: No contaminants, no impurities, no defects, no excess material, no deformation.

Packaging Quantity: 10K/15K/20K/25K/30K per bottle, or customized according to customer requirements.

Features: Compared with ordinary BGA solder balls, copper-core balls have more excellent thermal and electrical conductivity as well as collapse strength, which can maintain stable packaging space and reduce external influences.

Properties: It has higher reliability compared with Sn10/Pb90 solder posts of the same specification.

Usage: For pillar planting in IC packaging.
 Quality Guarantee Period: 12 months
 Storage Conditions: Temperature: 10-30℃; Humidity: <50%. Store in a sealed, dust-free environment, or under vacuum or nitrogen atmosphere. In principle, the package should be used up at one time after opening; if not fully used, it should be sealed and stored promptly.