Quality Characteristics
Ball Core: TU2 oxygen-free purple
copperShape: Spherical
Appearance: Silver-white (with tin-based solder plating) or golden-yellow (with gold plating); free from contaminants, impurities, depressions, convex points, and connected balls.
Packaging Quantity: 250K per bottle, or as per customer requirements.
Features: Compared with ordinary BGA solder balls, copper core balls offer superior thermal and electrical conductivity as well as collapse strength, which can maintain stable packaging space and reduce external influences.
Properties: Precisely processed from pure copper with extremely low impurity content.
Applications: Dedicated to solder ball mounting processes such as multi-level structure packaging, 3D packaging, and POP (Package on Package) stacking, or used as special supporting pins for substrates.
Quality Guarantee Period: 12 months
Storage Conditions:
Ambient temperature: 10℃ - 30℃Relative
humidity: 30%RH - 70%RHShould be stored in a dry and clean environment.
