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BGA (Ball Grid Array) packaging is the leading technology in integrated circuit packaging and the only option for mobile phone and memory chips. It is widely used in industries such as computers, telecommunications, automotive, home appliances, smart devices, and aerospace.

It ensures space efficiency, facilitates the realization of a highly reliable component embedding structure, and enables narrow-pitch packaging.
It features high conductivity, high heat dissipation performance, and excellent resistance to electromigration.

Characterized by high density, high electrical conductivity, high thermal dissipation, and high reliability, it addresses the bottlenecks of traditional interconnect structures in advanced electronic packaging and has become a critical component supporting improvements in chip performance and device miniaturization.

Endowed with low cost, mature processing technology, favorable electrical conductivity, and moderate reliability, High lead solder Column have become an important component for achieving chip-to-substrate interconnection in medium- and low-density electronic packaging. Compared with Copper Column, High lead solder Column focus more on economy and process compatibility rather than extreme density or heat dissipation capability.