Product application：H608 is a low-residue, no-clean paste flux, suitable for the bottom of the component after
reflow where the filling glue is required, and occasions of direct plastic sealing without cleaning flux residue, etc.
Product features
1)Milky, aromatic odor, environmentally friendly products.
2)Compatible with SnAgCu, SnAg and other medium temperature alloy solder.
3)The solder surface is shiny, clean and does not change color.
4)Fast tin welding, no needle eye, exposed copper and other defects.
5)Residues are extremely low and non-corrosive.
6)Non-flammable, no dangerous goods control required.
Product performance
7)Appearance：Milky white paste
8)Packing：Needle tube 25g/tube, can also be packaged according to customer needs
Storage：2-10 °C can be stored for 6 months, Use as soon as possible after opening.
Ambient temperature and humidity：Temperature 23±3°C, relative humidity 45±15%.