JINNHOO SEMICONDUCTOR(GUANGDONG HENGQIN) CO., LTD.® is a high-tech enterprise specializing in semiconductor packaging materials, offering a comprehensive range of services from R&D and production to sales. We focus on advanced spherical and columnar materials for semiconductor applications, with key products including: packaging bumps (BGA solder balls, flip-chip bumps, copper core balls, copper pillars), CCGA solder columns, copper columns, copper tape-wound spiral solder columns, spring solder columns, flux, solder paste, preform solder, solder mask, and more.
With fully independent intellectual property, JINNHOO has achieved significant breakthroughs in both equipment and process technologies, ensuring 100% domestic production, from manufacturing to final product delivery. Our products are widely used in military and civilian electronics, and we offer tailored solutions to meet the specific R&D and production needs of our clients.
Subsidiary company (production base)
HAIPU Semiconductor® was established in March 2019 with a registered capital of 12 million RMB. Located in the Aerospace Industrial Park of the Industrial Cluster Area in Yiyang County, Henan Province, the company occupies over 2,000 square meters and features a class 10,000 cleanroom.
HAIPU is recognized as a National High-Tech Enterprise, a National Technology-based SME, and the Luoyang Electronics Packaging Materials Enterprise R&D Center. The company is also a member of the China Semiconductor Industry Association.