High lead solder Column

This product is specially designed for the pillar planting process in IC packaging.



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uality Characteristics
Main alloy: Pb90/Sn10

Shape: CylindricalAppearance: Silver-gray, free from contaminants, impurities, defects, excess material and deformation.

Packaging quantity: 10K/15K/20K/25K/30K per bottle, or as per customer requirements.

Features: Precisely processed from pure tin and pure lead with extremely low impurity content.

Application: For pillar planting in IC packaging.



Quality Guarantee Period: 12 months


Storage conditions: Ambient temperature: 10℃-30℃; Relative humidity: 30%RH-70%RH; Should be stored in a dry and clean environment.