Copper Column
Mainly used for pillar planting in IC packaging to realize electrical interconnection and structural support between chips and substrates, ensuring stable signal transmission.
Suitable for the assembly of electronic components in consumer electronics, industrial control and other fields, such as playing a role in spacing and conduction in motherboards and modules.
Due to the characteristics of pure copper, it is also used in scenarios requiring low-impedance and high-reliability connections to facilitate stable packaging structures.

Quality Characteristics

Main alloy: Cu

Shape: Cylindrical

Appearance: Brownish-red, free from contaminants, impurities, defects, excess material and deformation.

Packaging quantity: 10K/15K/20K/25K/30K per bottle, or as per customer requirements.

Features: Precisely processed from pure copper with extremely low impurity content.

Application: For pillar planting in IC packaging.

Quality Guarantee Period: 12 months

Storage conditions: Ambient temperature: 10℃-30℃; Relative humidity: 30%RH-70%; Should be stored in a dry and clean environment.