ABOUT US
JINNHOO SEMICONDUCTOR(GUANGDONG HENGQIN) CO., LTD.® is a high-tech enterprise specializing in semiconductor packaging materials, offering a comprehensive range of services from R&D and production to sales. We focus on advanced spherical and columnar materials for semiconductor applications, with key products including: packaging bumps (BGA solder balls, flip-chip bumps, copper core balls, copper pillars), CCGA solder columns, copper columns, copper tape-wound spiral solder columns, spring solder columns, flux, solder paste, preform solder, solder mask, and more.
With fully independent intellectual property, JINNHOO has achieved significant breakthroughs in both equipment and process technologies, ensuring 100% domestic production, from manufacturing to final product delivery. Our products are widely used in military and civilian electronics, and we offer tailored solutions to meet the specific R&D and production needs of our clients.
Product
BGA Solder Ball
High lead solder Column
Solder Paste
Copper Core Ball
Copper Wrapped Column
BGA/CSP/Flipchip FLUX
Copper Column
Micro-Coil Spring
Preformed Solder
Factory Video
CASE SHOW